1
layer
1-18 layer
2
Material
FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2
3
Board thickness
0.2mm-4mm
4
Max.finished board side
800*508mm
5
Min.drilled hole size
0.25mm
6
min.line width
0.075mm(3mil)
7
min.line spacing
0.075mm(3mil)
8
Surface finish/treatment
HALS/HALS lead free,Chemical tin,Chemical Gold,
Immersion gold Immersion Silver/Gold,Osp,Gold Plating
9
Copper thickness
0.5-4.0oz
10
Solder mask color
green/black/white/red/blue/yellow
11
Inner packing
Vacuum packing,Plastic bag
12
Outer packing
standard carton packing
13
Hole tolerance
PTH:±0.076,NTPH:±0.05
14
Certificate
UL,ISO9001,ISO14001,ROHS,CQC
15
profiling punching
Routing,V-CUT,Beveling
16 providing OEM service to all sorts of printed circuit board assembly